粉體行業在線展覽
粉體行業在線展覽
直接聯系
上海載德半導體技術有限公司
美國
面議
1320
團簇式多腔體真空系統(星型)用于多層膜結構的沉積和生長，可以消除交叉污染，有利于高品質電學器件的制備。
Cluster tools eliminate cross-contamination in multi-layer thin film structures and allow the production of high-quality electronic devices. Each module as described below is controlled independently allowing simultaneous deposition in all chambers.
真空水平 Vacuum:Ultra-high vacuum (UHV).
基底尺寸 Substrate size:10cmx10cm or 15.6cmx15.6cm.
功能模塊 Modules:
PECVD: RF， VHF and pulsed (modulated) RF plasma.
HWCVD.
Sputtering (ITO， AZO， metals， etc) with oscillation.
Laser crystallization.
Rapid thermal annealing.
Park station with heating capability
Isolation and Transfer Zone (ITZ) with robotic arm (8 or 10 port locations)
Load lock with the following options:
single substrate capability.
connection to glove box.
multi-substrate capability.
In-situ characterization module
系統控制 Control:Computer controlled with easy to use HMI and optional data logging.
系統保證 Systems guarantees are defined in the contract and include*:
Base pressure on each chamber
Temperature calibration
Uniformity and opto-electronic properties for each material defined in the contract
Functionality of all systems
* These are demonstrated during the Factory (or First) acceptance test (FAT) and Site (or Second) Acceptance Tests (SAT)
